Hot pressing head

热压头

Abstract

本发明涉及一种热压头,包括安装基板、陶瓷基板、固定块,所述陶瓷基板与所述固定块夹紧在一起,所述固定块固定在安装基板上,所述陶瓷基板底端设置有电热丝,所述电热丝的两端设置有张紧装置,所述固定块上设置有螺孔,所述固定块与所述安装基板螺纹固定,所述电热丝的长度大于所述陶瓷基板的长度。本发明的有益效果是热压机在温度达到工艺所要求的180℃,即使温度达到450℃时,热压头的平面度还可以达到±5μm,在给产品施加压力和温度时,可以使产品中间的导电离子达到均匀的温度和压力要求,生产出合格的产品,满足了现在市场所需要的大面板及大尺寸的液晶屏、触摸屏的要求,具有很好的经济效益。
The invention relates to a hot pressing head, comprising an installation substrate, a ceramic substrate and fixing blocks, wherein the ceramic substrate is clamped with the fixing blocks; the fixing blocks are fixed on the installation substrate; the bottom end of the ceramic substrate is provided with heating wires; the two ends of the heating wires are provided with tension devices; the fixing blocks are provided with screw holes; the fixing blocks are fixed with the installation substrate through threads; and the length of the heating wire is longer than the length of the ceramic substrate. The invention has the advantages that when the temperature of a hot press reaches 180 DEG C required by the process, i.e. the temperature reaches 45 DEG C, the flatness of the hot pressing head further reaches +/- 5 mu m; when pressure and temperature are applied to the product, conductive ions among the products can be enabled to reach the requirements of even temperature and pressure so that qualified products are produced, thereby satisfying the requirements of a liquid crystal display and a touching screen with a big panel and a large size in the current market and having good economic benefit.

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Patent Citations (4)

    Publication numberPublication dateAssigneeTitle
    CN-201720602-UJanuary 26, 2011苏州工业园区赫光科技有限公司Thermal press head
    JP-2001274200-AOctober 05, 2001Toshiba Corp, 株式会社東芝Thermocompression bonding apparatus of tape carrier package for manufacturing plane display device
    JP-2002026494-AJanuary 25, 2002Shibaura Mechatronics Corp, 芝浦メカトロニクス株式会社電子部品の熱圧着装置
    JP-2002261127-ASeptember 13, 2002Optrex Corp, オプトレックス株式会社Apparatus for thermo compression bonding

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